* The application period for the subsidy ends on 30 June 2023. Subsidy offer is up to HKD50,000 for each successful applicant. The decision of The Hongkong and Shanghai Banking Corporation Limited on application approval shall be final and conclusive. Refer to application form for terms and conditions.
^ The application period for the waiver ends on 31 December 2022. Handling fee waiver period is up to 60 months for each successful applicants.
Please contact us on +852 2748 8238 for the pricing and more details.